H. Chaabouni

Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs

R. Anciant, N. Sillon, P. Coudrain, 2010, 2010 IEEE International Interconnect Technology Conference.

Impact of the CMP process on the electrical properties of ultra low k porous SiOCH

A. Farcy, A. Sylvestre, H. Chaabouni, 2010 .

Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

A. Farcy, P. Brun, T. Chevolleau, 2007 .

Monitoring fracture of high-strength steel under tensile and constant loading using acoustic emission analysis

P. Bocher, L. Toubal, H. Chaabouni, 2020 .

Impact of ULK restoration techniques on propagation performance for interconnects of the 45 nm technology node and below

A. Farcy, T. Lacrevaz, C. Bermond, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL

N. Jourdan, A. Farcy, P. Brun, 2007, 2007 IEEE International Interconnect Technology Conferencee.