H. Yagi

Compatibility of NiSi in the self-aligned suicide process for deep submicrometer devices

S. Ozawa, R. Mukai, H. Yagi, 1995 .

Planarized Copper Multilevel Interconnections for ULSI Applications

T. Ohba, T. Ohba, N. Misawa, 1994 .

TiN-encapsulized copper interconnects for ULSI applications

K. Hoshino, H. Yagi, H. Tsuchikawa, 1989, Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference.

Heat capacity measurements of MnxFe3−xO4

H. Inaba, H. Yagi, K. Naito, 1981 .

Heat capacity anomalies due to the cooperative Jahn-Teller effect in Cu1−xNixCr2O4

H. Inaba, H. Yagi, K. Naito, 1986 .

Diffusional relaxation and void growth in an aluminum interconnect of very large scale integration

H. Tsuchikawa, H. Yagi, Masaharu Kato, 1990 .

Decomposition Property of Methylhydrazine with Titanium Nitridation at Low Temperature

Toshiyasu Suzuki, H. Yagi, Y. Furumura, 1995 .

Stress distribution in an aluminum interconnect of very large scale integration

H. Tsuchikawa, H. Yagi, Masaharu Kato, 1990 .

Effect of titanium addition to copper interconnect on electromigration open circuit failure

K. Hoshino, H. Yagi, H. Tsuchikawa, 1990, Seventh International IEEE Conference on VLSI Multilevel Interconnection.