K. Gilleo

Overview of new packages, materials and processes

K. Gilleo, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Advances in Packaging and Assembly Polymers

K. Gilleo, 1996 .

Direct chip interconnect using polymer bonding

K. Gilleo, 1989, Proceedings., 39th Electronic Components Conference.

THE PRINTED PACKAGE REVOLUTION

K. Gilleo, T. Cinque, C. Lee, 1996 .

New Optoelectronics (OE) Packaging; Concepts and Preliminary Results

K. Gilleo, Cookson Electronics, P. Chouta, 2002 .

The Great Underfill Race

K. Gilleo, D. Blumel, 1998 .

Expanding the capability of flexible circuitry

K. Gilleo, 1990 .

Photonics challenge to electronic packaging

K. Gilleo, 2001 .

Assembly with Conductive Adhesives

K. Gilleo, K. Gilleo, 1995 .

Halogen free packaging materials

K. Gilleo, B. Varnell, A. Rae, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).