Choon Heung Lee

A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design

Choonheung Lee, M. W. Lee, Joon-Yeob Lee, 2008, 2008 58th Electronic Components and Technology Conference.

Below 45nm low-k layer stress minimization guide for high-performance flip-chip packages with copper pillar bumping

Jin Young Kim, Choonheung Lee, M. W. Lee, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Study of FCMBGA with low CTE core substrate

Nokibul Islam, Miguel Jimarez, Robert Darveaux, 2009, 2009 59th Electronic Components and Technology Conference.