Genevieve Beique

发表

Application of frequency domain line edge roughness characterization methodology in lithography

Lei Sun, Wenhui Wang, Obert Wood, 2015, Advanced Lithography.

Plasma etch patterning of EUV lithography: balancing roughness and selectivity trade off

Lei Sun, Andrew Metz, Matthew E. Colburn, 2016, SPIE Advanced Lithography.

EUV patterning successes and frontiers

Yongan Xu, Nelson Felix, Hao Tang, 2016, SPIE Advanced Lithography.

LER improvement for sub-32nm pitch self-aligned quadruple patterning (SAQP) at back end of line (BEOL)

Akiteru Ko, Peter Biolsi, Lei Sun, 2016, SPIE Advanced Lithography.

Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)

John Arnold, Andrew Metz, Kaushik Kumar, 2015, Advanced Lithography.

Single-expose patterning development for EUV lithography

Joe Lee, Lei Sun, Indira Seshadri, 2017, Advanced Lithography.

Introduction of pre-etch deposition techniques in EUV patterning

John Arnold, Lei Sun, Dominik Metzler, 2018, Advanced Lithography.

Line edge roughness frequency analysis during pattern transfer in semiconductor fabrication

Lei Sun, Wenhui Wang, Obert Wood, 2015 .

Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL

John Arnold, Peng Wang, Yann Mignot, 2015, Advanced Lithography.