Elisabete Fernandes

Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages

Alberto Martins, André Cardoso, Leonor Dias, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Integration of MEMS/Sensors in Fan-Out wafer-level packaging technology based system-in-package (WLSiP)

Elisabete Fernandes, Steffen Kroehnert, Raquel Pinto, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)

Elisabete Fernandes, Steffen Kroehnert, Andre Cardoso, 2017 .

Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical Applications

Elisabete Fernandes, Steffen Kroehnert, Andre Cardoso, 2017 .