Abel Janeiro

Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages

Alberto Martins, André Cardoso, Leonor Dias, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

Abel Janeiro, Steffen Kroehnert, Jose Campos, 2015 .