K.C. Chiang

Modeling RF MOSFETs after electrical stress using low-noise microstrip line layout

H.L. Kao, A. Chin, J.M. Lai, 2005, 2005 IEEE Radio Frequency integrated Circuits (RFIC) Symposium - Digest of Papers.

Novel SiO/sub 2//AlN/HfAIO/IrO/sub 2/ memory with fast erase, large /spl Delta/V/sub th/ and good retention

K.C. Chiang, S.P. McAlister, A. Chin, 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

High-Temperature Leakage Improvement in Metal–Insulator–Metal Capacitors by Work–Function Tuning

K.C. Chiang, A. Chin, C.P. Chou, 2007, IEEE Electron Device Letters.

High-Density and Low-Leakage-Current MIM Capacitor Using Stacked $\hbox{TiO}_{2}/\hbox{ZrO}_{2}$ Insulators

K.C. Chiang, S.H. Lin, A. Chin, 2009, IEEE Electron Device Letters.

RFIC TaN/SrTiO$_3/$TaN MIM Capacitors With 35fF$/muhboxm^2$Capacitance Density

K.C. Chiang, W.J. Chen, A. Chin, 2006, IEEE Microwave and Wireless Components Letters.

Very high K and high density TiTaO MIM capacitors for analog and RF applications

K.C. Chiang, W.J. Chen, A. Chin, 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

Very high-density (23 fF//spl mu/m/sup 2/) RF MIM capacitors using high-/spl kappa/ TaTiO as the dielectric

K.C. Chiang, A. Chin, C.H. Lai, 2005, IEEE Electron Device Letters.

High-Performance$hboxSrTiO_3$MIM Capacitors for Analog Applications

K.C. Chiang, A. Chin, A. Chin, 2006, IEEE Transactions on Electron Devices.

High Performance Micro-Crystallized TaN/SrTiO3/TaN Capacitors for Analog and RF Applications

K.C. Chiang, W.J. Chen, A. Chin, 2006, 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers..