Melvin P. Zussman

Electrical Reliability of Cu and Low- K Dielectric Integration

Alvin Leng Sun Loke, Paul H. Townsend, S. Wong, 1998 .

High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)

Toshiaki Itabashi, Melvin P. Zussman, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).