S. Mignot

56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via

Yongan Xu, Yunpeng Yin, Chiew-seng Koay, 2012, 2012 IEEE International Interconnect Technology Conference.

Si nanowire CMOS fabricated with minimal deviation from RMG FinFET technology showing record performance

N. Loubet, T. Yamashita, J. A. Ott, 2015, 2015 Symposium on VLSI Technology (VLSI Technology).