Kunihiko Nishi

Resin-enclosed semi-conductor device

Hideo Inayoshi, Kunihiko Nishi, Yoshiaki Wakashima, 1978 .

Development and application of the stress sensing test chip for IC plastic packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1987 .

Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1991 .

Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

Masatsugu Ogata, Kunihiko Nishi, K. Dušek, 1989, Speciality Polymers / Polymer Physics.

Speciality Polymers/Polymer Physics

Masatsugu Ogata, Kunihiko Nishi, Yu. K. Godovsky, 1989 .

Analysis of package cracking during reflow soldering process

Kunihiko Nishi, Makoto Kitano, Asao Nishimura, 1988, 26th Annual Proceedings Reliability Physics Symposium 1988.

A study of package cracking during the reflow soldering process.

Kunihiko Nishi, Makoto Kitano, Asao Nishimura, 1989 .