Jihye Kim

Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC

Joungho Kim, Rao Tummala, Venky Sundaram, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)

Joungho Kim, Rao Tummala, Venky Sundaram, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).