Dennis Miller

Modeling of multi-vias coupling for high speed interconnects

Leung Tsang, Chung-Chi Huang, Dennis Miller, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

Comparison of surface electric field and impedance matrix elements of layered media between electric field spatial green's function and mixed potential

Leung Tsang, Chung-Chi Huang, Dennis Miller, 2002 .

Sensor Link Protocol: A Common Digital Information Link for Sensor Systems

Doug Moore, Dennis Miller, Bill Peters, 1998 .

Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane

Leung Tsang, Dennis Miller, L. Tsang, 2003 .

Combat Service Support Control System (CSSCS), Cost and Operational Effectiveness Analysis (COEA), Analysis Plan

Donald W. Kroening, Dennis Miller, Robert W. Brown, 1993 .

Midisoft Studio 2.02 (IBM): if getting started is the hardest part of sequencing, Midisoft's program could be just the ticket

Dennis Miller, 1991 .