Bruno Levrier

发表

Use of signal processing imaging for the study of a 3D package in harsh environment

Laurent Béchou, Yves Ousten, Jean Augereau, 2006, Microelectron. Reliab..

Extraction of the MLCC Matrix of Compliance Used for Reliability

Yves Ousten, Laurent Bechou, Jean Augereau, 2003 .

Embedded passive components to increase the reliability of high frequency electronic circuits

Philippe Kertesz, Geneviève Duchamp, Yves Ousten, 2006 .

Defect detection in multilayer ceramic capacitors

Wolfgang Wondrak, Yves Ousten, Bruno Levrier, 2006, Microelectron. Reliab..

Different Approaches to Packaging Reliability

Laurent Bechou, Frédéric Verdier, Yannick Deshayes, 2008 .

Reliability Assessment: New Tools for the Next Generation of Packages

Laurent Bechou, Yannick Deshayes, Yves Ousten, 2008 .

Embedded Passive Design for High Speed Circuits

Philippe Kertesz, Geneviève Duchamp, Yves Ousten, 2004 .

A novel approach on accelerated ageing towards reliability optimization of high concentration photovoltaic cells

Laurent Bechou, Bruno Levrier, Alain Dollet, 2014 .

A novel approach of accelerated ageing tests for high concentration III–V multijunction solar cells through rapid irradiation/thermal cycles

Bruno Levrier, Alain Dollet, Alexis Vossier, 2015 .

Environmental conditions influence on embedded capacitors - Comparison with discrete capacitors

Laurent Bechou, Philippe Kertesz, Yves Ousten, 2010 .

Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly

Ephraim Suhir, Laurent Bechou, Bruno Levrier, 2013 .