Amy Palesko

Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling

Amy Palesko, 2014 .

A Cost and Yield Analysis of Wafer-to-wafer Bonding

Amy Palesko, Chet Palesko, 2015 .

Cost Comparison of 2.5D/3D Packaging to other Packaging Technologies

Amy Palesko, Chet Palesko, E. Jan Vardaman, 2013 .

Cost Breakdown of 2.5D and 3D Packaging

Amy Palesko, Chet Palesko, 2016 .

Cost and Yield Comparison of Wafer-to-Wafer, Die-to-Wafer, and Die-to-Die Bonding

Amy Palesko, Chet Palesko, 2014 .

Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling

Amy Palesko, Chet Palesko, 2014 .

Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging

Amy Palesko, Chet Palesko, E. Jan Vardaman, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).