Yong Kong Siew

Statistical significance of STEM based metrology on advanced 3D transistor structures

Laurens Kwakman, Anne Kenslea, Hayley Johanesen, 2019, Advanced Lithography.

Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices

Michael Strauss, Anne Kenslea, Hayley Johanesen, 2019, Advanced Lithography.

Evaluation of alignment marks using ASML ATHENA alignment system in 90-nm BEOL process

S. H. Yeo, Yee Mei Foong, Yong Kong Siew, 2003, SPIE Advanced Lithography.

A novel approach for dual damascene trench etch for 90nm low-K interconnect with no middle etch stop layer

Rakesh Jaiswal, Alok Jain, Yong Kong Siew, 2003 .

Spacer defined double patterning for (sub-)20nm half pitch single damascene structures

Vincent Wiaux, Harold Dekkers, Gerald Beyer, 2011, Advanced Lithography.

Alternative metals for advanced interconnects

Christoph Adelmann, Geoffrey Pourtois, Sven Van Elshocht, 2014, IEEE International Interconnect Technology Conference.