Niccolò Rinaldi

发表

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2017, Microelectron. Reliab..

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2015, Microelectron. J..

Advanced thermal simulation of SiGe: C HBTs including back-end-of-line

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2016, Microelectron. Reliab..

Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit

Thomas Zimmer, Anjan Chakravorty, Vincenzo d'Alessandro, 2015, Microelectron. Reliab..

Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs

Niccolò Rinaldi, Grazia Sasso, M. Costagliola, 2010, Microelectron. Reliab..

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Alessandro Magnani, Najib Laraqi, Lorenzo Codecasa, 2018, Microelectron. Reliab..

Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations

Andrea Irace, Alessandro Magnani, Giovanni Breglio, 2013, Microelectron. Reliab..

An Experimental Power-Lines Model for Digital ASICs Based on Transmission Lines

Davide De Caro, Antonio Girardi, Roberto Izzi, 2012, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers

Vincenzo d'Alessandro, Peter J. Zampardi, Niccolò Rinaldi, 2013, Microelectron. Reliab..

Delphi-like dynamical compact thermal models using model order reduction

Alessandro Magnani, Najib Laraqi, Lorenzo Codecasa, 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect

Zbigniew Lisik, Malgorzata Langer, Janusz Wozny, 2004, International Conference on Computational Science.

Analysis of the thermal behavior of AlGaN/GaN HEMTs

Salvatore Russo, Vincenzo d'Alessandro, Niccolò Rinaldi, 2012 .

Novel approach for the extraction of nonlinear compact thermal models

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Composition grading for base transit time minimization in HBTs: An analytical approach

Niccolò Rinaldi, P. Rinaldi, 1997 .

A critical review of thermal models for electro-thermal simulation

Vincenzo d'Alessandro, Niccolò Rinaldi, V. d’Alessandro, 2002 .

Microscopic Hot-Carrier Degradation Modeling of SiGe HBTs Under Stress Conditions Close to the SOA Limit

Thomas Zimmer, Christoph Jungemann, Cristell Maneux, 2017, IEEE Transactions on Electron Devices.

On the modeling of the transient thermal behavior of semiconductor devices

Niccolò Rinaldi, N. Rinaldi, 2001 .

Analysis and modeling of small-signal bipolar transistor operation at arbitrary injection levels

H. C. de Graaff, Niccolò Rinaldi, J. L. Tauritz, 1998 .

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2018, Microelectron. Reliab..

Connecting MOR-based boundary condition independent compact thermal models

Alessandro Magnani, Lorenzo Codecasa, Vincenzo d'Alessandro, 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Thermal Effects in Thin Silicon Dies: Simulation and Modelling

Salvatore Russo, Vincenzo d'Alessandro, Niccolò Rinaldi, 2011 .

Small-signal operation of semiconductor devices including self-heating, with application to thermal characterization and instability analysis

Niccolò Rinaldi, N. Rinaldi, 2001 .