I. Turlik

Introducing the through-line deembedding procedure

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1992, 1992 IEEE Microwave Symposium Digest MTT-S.

Calculation of voltage drops in the vias of a multichip package

I. Turlik, L.-T. Hwang, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging

H. Merkelo, L.-T. Hwang, I. Turlik, 1992 .

Holographic optical interconnects for VLSI multichip modules

James E. Morris, Michael R. Feldman, I. Turlik, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Thermal stress analysis of a multichip package design

I. Turlik, R. Darveaux, A. Reisman, 1989, Proceedings., 39th Electronic Components Conference.

Power cycling and stress variation in a multichip module

I. Turlik, I. Turlik, B. Sur, 1995 .

Benzocyclobutene as a dielectric for multichip module fabrication

Philip E. Garrou, Joseph Carr, I. Turlik, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Effects of polymer/metal interaction in thin-film multichip module applications

I. Turlik, P.L. Smith, G.M. Adema, 1990, 40th Conference Proceedings on Electronic Components and Technology.