C. Cassidy

发表

Anysotropy of fusible interlinings mechanical properties

Stepan Vladimirovitch Lomov, C. Cassidy, 1999 .

Through Silicon Via (TSV) defect investigations using lateral emission microscopy

C. Cassidy, Jochen Kraft, Franz Schrank, 2010, Microelectron. Reliab..

Recording of Electric Signal Passing Through a Pylon in Direct Skeletal Attachment of Leg Prostheses With Neuromuscular Control

C. Cassidy, M. Pitkin, R. Muppavarapu, 2012, IEEE Transactions on Biomedical Engineering.

Depth-resolved photoemission microscopy for localization of leakage currents in through Silicon Vias (TSVs)

C. Cassidy, F. Schrank, J. Kraft, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.