I. Melville

3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform

Won Suk Lee, Subharup Gupta Roy, K. Nummy, 2020, 2020 IEEE Photonics Conference (IPC).

C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

T. Wassick, E. Misra, C. Muzzy, 2015 .

Integrated Laser Attach Technology on a Monolithic Silicon Photonics Platform

Won Suk Lee, Subharup Gupta Roy, K. Nummy, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform

Won Suk Lee, K. Nummy, R. Augur, 2023, IEEE Journal of Selected Topics in Quantum Electronics.

High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell

D. Mocuta, C. Norris, C. Radens, 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

Optical performance and reliability assessment from self-aligned single mode fiber attach for O-band silicon photonics platform

K. Nummy, N. Robson, A. Cestero, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal

K. Nummy, D. Moy, N. Robson, 2023, Optical Fiber Communications Conference and Exhibition.

A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment

Javier Ayala, Tymon Barwicz, Michal Rakowski, 2020, 2020 Optical Fiber Communications Conference and Exhibition (OFC).