Fumin Liu

A High Q-Factor Outer-Frame-Anchor Gyroscope Operating at First Resonant Mode

B. Jiang, Yan Su, Guowen Liu, 2020, Micromachines.

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

D. Guo, Ming Li, Xiaoguang Guo, 2022, Materials Science in Semiconductor Processing.

Atomistic understanding of interfacial processing mechanism of silicon in water environment: A ReaxFF molecular dynamics simulation

R. Kang, D. Guo, Ming Li, 2021, Frontiers of Mechanical Engineering.

Recycling of Flexible Polyurethane Foams by Regrinding Scraps into Powder to Replace Polyol for Re-Foaming

Xiurui Guo, Wenchao Wang, Haichao Liu, 2022, Materials.

Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing

R. Kang, Xiaoguang Guo, Lemin Zhang, 2022, Materials Science in Semiconductor Processing.