Sangmin Lee

Intrinsic swelling behavior of free-standing nanoporous ionomer-bound carbon films

Taek‐Soo Kim, Jae-bum Pyo, Sangmin Lee, 2021 .

Iron Gall Ink Revisited: In Situ Oxidation of Fe(II)–Tannin Complex for Fluidic‐Interface Engineering

I. Choi, J. Mano, Taek‐Soo Kim, 2018, Advanced materials.

Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers

T. Ohba, Taek‐Soo Kim, Young Suk Kim, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Low-Temperature and Corrosion-Resistant Gas Diffusion Multibarrier with UV and Heat Rejection Capability-A Strategy to Ensure Reliability of Organic Electronics.

Taek‐Soo Kim, K. Choi, Do‐Geun Kim, 2019, ACS applied materials & interfaces.

Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2o3 as a Free-Standing Film

Junmo Kim, J. Koo, J. Shim, 2020, Scripta Materialia.

Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography

Jae Hong Park, J. Shim, Taek‐Soo Kim, 2020, Nanomaterials.

Ultrathin, Flexible, and Transparent Oxide Thin‐Film Transistors by Delamination and Transfer Methods for Deformable Displays

Hyeok-Don Kim, Taek‐Soo Kim, Tae-Ik Lee, 2021, Advanced Materials Technologies.

A study on mechanical properties of thinned single crystal silicon wafer: Effect of size and direction

T. Ohba, Taek‐Soo Kim, Young Suk Kim, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Iron Gall Ink Revisited: In Situ Oxidation of Fe(II)–Tannin Complex for Fluidic‐Interface Engineering

I. Choi, J. Mano, Taek‐Soo Kim, 2018, Advanced materials.