Ying-Chang Hung

Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies

I. C. Ume, C. F. J. Wu, W. Tan, 2008, IEEE Transactions on Advanced Packaging.

Addition of TiO2 on the electrical properties of buried resistors in low-temperature cofired ceramics

Jiang-Tsair Lin, Ying-Chang Hung, Ching-Tai Cheng, 2003 .

Thermal-decomposition and crystallization behaviour of coupling agents for silver paste application

S. Shih, Hsin-Hsien Yeh, C. Shih, 2003 .

LTCC materials for high density multilayer interconnect

Yu-Ting Huang, W. Ko, Ying-Chang Hung, 2000 .