P. Daharwal

Effects of low-modulus die attach adhesive on warpage and damage of BGA

S. Yi, P. Daharwal, Y.J. Lee, 2005, 2005 International Symposium on Electronics Materials and Packaging.

High-temperature mechanical properties and fatigue of nanocrystalline nickel-cobalt-phosphorous (NiCoP) alloy

P. Diglio, P. Tadayon, S. Wozny, 2021, Materialia.