M. Yin

High Throughput Low Stress Air Jetting Carrier Release for RDL-First Fan-Out Wafer-Level-Packaging

Hsiang-Hung Chang, Wei Zhang, Hao Tang, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer

K. Inal, M. Saadaoui, G. Pares, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.