M. Nguyen

High Throughput Low Stress Air Jetting Carrier Release for RDL-First Fan-Out Wafer-Level-Packaging

Hsiang-Hung Chang, Wei Zhang, Hao Tang, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Measurement of the elastic properties of polymer melts

Bryce Maxwell, M. Nguyen, 1979 .

Flocculation of carbon black in filled rubber compounds. I. Flocculation occurring in unvulcanized compounds during annealing at elevated temperatures

M. Nguyen, G. Bohm, 1995 .

Melt elasticity of low density polyethylene

Bryce Maxwell, M. Nguyen, 1980 .

An ultra low moisture polymer adhesive for BGA packages

M. Nguyen, I. Chien, 1998 .

Development of an ultra low moisture polymer adhesive for die attach applications

M. Nguyen, I. Chien, 1997, Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium.

Flip chip repair process

M. N. Nguyen, N. R. Basavanhally, S. A. Gahr, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

Low stress silver-glass die attach materials

M. Nguyen, 1989 .