R. Kahle
发表
M. Schneider-Ramelow,
K. Lang,
M. Fließ,
2016
.
H. Reichl,
J. Korvink,
J. Lienemann,
2008,
2008 10th Electronics Packaging Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
R. Gambari,
R. Guerrieri,
H. Reichl,
2009,
2009 59th Electronic Components and Technology Conference.
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
F. Schein,
R. Kahle,
Mohamed Elghazzali,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Klaus-Dieter Lang,
Jens Weidenmüller,
Thomas Weimann,
2018,
International Symposium on Microelectronics.
M. Schneider-Ramelow,
R. Aschenbrenner,
T. Braun,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
R. Aschenbrenner,
K.-F. Becker,
O. Hoelck,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Steve Voges,
Tanja Braun,
Karl-Friedrich Becker,
2019,
Micromachines.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
A. Ostmann,
F. Schein,
M. Dietterle,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.