K. Becker
发表
M. Schneider-Ramelow,
K. Lang,
M. Fließ,
2016
.
H. Reichl,
J. Korvink,
J. Lienemann,
2008,
2008 10th Electronics Packaging Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
A. Ens,
A. Hulsmann,
K. Becker,
2013
.
R. Gambari,
R. Guerrieri,
H. Reichl,
2009,
2009 59th Electronic Components and Technology Conference.
M. Schneider-Ramelow,
S. Rzepka,
Lukas Rauter,
2020,
Micromachines.
J. Bauer,
T. Braun,
K.-F. Becker,
2014
.
Olaf Wittler,
Herbert Reichl,
Thomas Loher,
2005
.
Andreas Ostmann,
Herbert Reichl,
A. Neumann,
2005
.
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Christine Kallmayer,
Karl-Friedrich Becker,
M. Koch,
2008
.
M. Schneider-Ramelow,
R. Aschenbrenner,
T. Braun,
2023,
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Herbert Reichl,
K.-F. Becker,
M. Koch,
2006,
Microelectron. Reliab..
Herbert Reichl,
K.-F. Becker,
Rolf Aschenbrenner,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Klaus-Dieter Lang,
Jens Weidenmüller,
Thomas Weimann,
2018,
International Symposium on Microelectronics.
M. Schneider-Ramelow,
R. Aschenbrenner,
T. Braun,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
R. Aschenbrenner,
K.-F. Becker,
O. Hoelck,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
M. Koch,
2008,
2008 58th Electronic Components and Technology Conference.
Klaus-Dieter Lang,
Olaf Wittler,
Tanja Braun,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
R. Aschenbrenner,
T. Braun,
M. Topper,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Steve Voges,
Tanja Braun,
Karl-Friedrich Becker,
2019,
Micromachines.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
M. Schneider-Ramelow,
I. Ndip,
K. Lang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
M. Kaynak,
M. Wietstruck,
R. Aschenbrenner,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
C. P. Wong,
H. Reichl,
Jianmin Qu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
M. Schneider-Ramelow,
T. Braun,
M. Wöhrmann,
2023,
IMAPSource Proceedings.
K. Lang,
R. Aschenbrenner,
H. Walter,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
K. Lang,
R. Aschenbrenner,
M. Koch,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
M. Koch,
2010,
3rd Electronics System Integration Technology Conference ESTC.
H. Reichl,
R. Aschenbrenner,
M. Koch,
2010,
2010 International Symposium on Advanced Packaging Materials: Microtech (APM).
H. Reichl,
K.-F. Becker,
B. Wunderle,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
H. Reichl,
K.-F. Becker,
B. Wunderle,
2010,
3rd Electronics System Integration Technology Conference ESTC.