H. Wee

Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material

V. N. Sekhar, V. S. Rao, G. Sharma, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

S. Yoon, Xiaowu Zhang, V. Kripesh, 2010, IEEE Transactions on Advanced Packaging.

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

V. Kripesh, Seung Wook Yoon, Hnin Wai Yin, 2008, 2008 10th Electronics Packaging Technology Conference.

Programmable Nerve/Muscle

Xu Liu, Yong Ping Xu, Keng Hoong Wee, 2011 .

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Li Hong Yu, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.