T. Wong
发表
K. Leong,
T. Wong,
J. Y. Ho,
2021,
Thermal Science and Engineering Progress.
F. Duan,
P. Chan,
Y. Chua,
2010,
2010 The 2nd International Conference on Computer and Automation Engineering (ICCAE).
K. Toh,
F. Duan,
K. Choo,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
K. Ranjith,
T. Wong,
J.L. Xie,
2020
.
K. Toh,
F. Duan,
K. Choo,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
Y. Joshi,
D. Pinjala,
T. Wong,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
D. Pinjala,
T. Wong,
H.Y. Zhang,
2005,
2005 7th Electronic Packaging Technology Conference.
M. Iyer,
Y. Joshi,
K. Toh,
2005
.
K. Leong,
J. Y. Ho,
N. Miljkovic,
2021
.
J. Y. Ho,
K. F. Rabbi,
S. Sett,
2021
.
J. Y. Ho,
R. Kandasamy,
P. Liu,
2020
.
Kai Choong Leong,
J. Y. Ho,
Y. S. See,
2021
.
Y. Joshi,
K. Toh,
D. Pinjala,
2005
.
K. K. Wong,
Kin Keong Wong,
K. Leong,
2016
.
Y. F. Yap,
T. N. Wong,
L. Yobas,
2008
.
J. Chai,
Y. Yap,
T. Wong,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Kim Tiow Ooi,
T. N. Wong,
S. H. Chong,
2002
.
J. Y. Ho,
Y. S. See,
T. Wong,
2022,
Applied Energy.
D. Pinjala,
V. Kripesh,
Hengyun Zhang,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
K. Toh,
T. Wong,
Damaruganath Pinjala,
2007
.
H.Y. Zhang,
D. Pinjala,
M.K. Iyer,
2005,
IEEE Transactions on Components and Packaging Technologies.
H.Y. Zhang,
D. Pinjala,
M.K. Iyer,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).