M. Lenz

A versatile electrothermal model of an integrated full bridge device taking into account various boundary conditions

O. Schepp, M. Lenz, 1997, Proceedings of APEC 97 - Applied Power Electronics Conference.

Thermal transient characterization methodology for single-chip and stacked structures

M. Lenz, O. Steffens, P. Szabo, 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..