G. Dody

Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

J. Lau, S. Erasmus, G. Dody, 1992 .

Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints

G. Y. Masada, J. Tien, A. I. Attarwala, 1991 .