K. Byun

Comparison of different surface orientation in narrow fin MuGFETs

Chi-Woo Lee, J. Colinge, A. Afzalian, 2009 .

Low temperature germanium to silicon direct wafer bonding using free radical exposure

I. Ferain, M. Goorsky, M. Morris, 2010 .

Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding

I. Ferain, K. Byun, C. Colinge, 2010 .

Fabrication of Germanium-on-Insulator by low temperature direct wafer bonding

I. Ferain, R. Yu, K. Byun, 2010, 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology.

Wafer Bonded Ge-Si Heterostructure for Avalanche Photodiode Application

B. Corbett, J. Hayes, F. Gity, 2011 .

Comprehensive investigation of Ge–Si bonded interfaces using oxygen radical activation

P. McNally, I. Ferain, M. Morris, 2011 .

Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integration

Cindy Colinge, Ki Yeol Byun, K. Byun, 2012, Microelectron. Reliab..

Low temperature exfoliation process in hydrogen-implanted germanium layers

I. Ferain, M. Goorsky, K. Byun, 2010 .

Low-Temperature Fabrication of Germanium-on-Insulator Using Remote Plasma Activation Bonding and Hydrogen Exfoliation

I. Ferain, M. Goorsky, R. Yu, 2011 .

Characterization of germanium/silicon p–n junction fabricated by low temperature direct wafer bonding and layer exfoliation

Brian Corbett, Alan P. Morrison, Karim Cherkaoui, 2012 .