Y. Henrion

Backside illuminated SPAD image sensor with 7.83μm pitch in 3D-stacked CMOS technology

S. Pellegrini, Y. Henrion, R. K. Henderson, 2016, 2016 IEEE International Electron Devices Meeting (IEDM).

Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle

E. Deloffre, A. Farcy, P. Vivet, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

F. Fournel, F. Gigon, E. Deloffre, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Back-thinned CMOS sensor optimization

Paul Jerram, Neil Guyatt, David W. Burt, 2010, OPTO.

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

L. Arnaud, E. Deloffre, A. Farcy, 2018, 2018 IEEE International Electron Devices Meeting (IEDM).