H. Hiyama

A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm

K. Tatani, H. Nakayama, J. Yamamoto, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).

A Back Illuminated 6 µm SPAD Pixel Array with High PDE and Timing Jitter Performance

H. Maeda, S. Yoshida, Y. Otake, 2021, 2021 IEEE International Electron Devices Meeting (IEDM).

A SPAD Depth Sensor Robust Against Ambient Light: The Importance of Pixel Scaling and Demonstration of a 2.5μm Pixel with 21.8% PDE at 940nm

S. Yoshida, Y. Otake, H. Hiyama, 2022, 2022 International Electron Devices Meeting (IEDM).