D. Vallett

FA Future Requirements

D. Vallett, 1999 .

Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

T. Chai, L. C. Wai, D. Vallett, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Non-Invasive Backside Failure Analysis of Integrated Circuits by Time-Dependent Light Emission: Picosecond Imaging Circuit Analysis

D. Knebel, J. Kash, J. Tsang, 1998 .

High-Resolution Backside GMR Magnetic Current Imaging on a Contour-Milled Globally Ultrathin Die

D. Vallett, 2014 .

Time-resolved optical characterization of electrical activity in integrated circuits

J.A. Kash, J.C. Tsang, D.P. Vallett, 2000, Proceedings of the IEEE.

Diagnosis and characterization of timing-related defects by time-dependent light emission

Leendert M. Huisman, Franco Motika, Moyra K. McManus, 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).

Fault isolation challenges and opportunities for proximal-probe imaging

D. Vallett, 2012, 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Picosecond imaging circuit analysis

David P. Vallett, Jeffrey A. Kash, James C. Tsang, 1998, IBM J. Res. Dev..