Shiu-Fang Yen

Technical Understanding of Resin-Coated-Copper (RCC) Lamination Processes for Realization of Reliable Chip Embedding Technologies

H. Reichl, R. Aschenbrenner, D. Manessis, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Electroluminescence from Solution Grown n-ZnO Nanorod/p-GaN-Heterostructured Light Emitting Diodes

H. Lee, Ching-Ting Lee, S. Dalui, 2010 .

High Power Large Size HFCBGA Thermal Characterization

M. Shih, Shiu-Fang Yen, D. Tarng, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).