S. Karaszkiewicz

Chip embedding technology developments leading to the emergence of miniaturized system-in-packages

K. Lang, D. Manessis, R. Aschenbrenner, 2010, 18th European Microelectronics & Packaging Conference.

Implementation of chip embedding processes for the creation of miniaturized system-in-packages

K. Lang, D. Manessis, R. Aschenbrenner, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Power modules with embedded components

L. Boettcher, S. Karaszkiewicz, D. Manessis, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).