Liang-Yuh Chen

A selective CVD tungsten process for micromotors

N. C. MacDonald, Liang-Yuh Chen, N. MacDonald, 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

Copper CMP at low shear force for low-k compatibility

L. Xia, Lizhong Sun, W. Hsu, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Plasma induced microstructural, compositional, and resistivity changes in ultrathin chemical vapor deposited titanium nitride films

M. Eizenberg, R. Kröger, Liang-Yuh Chen, 2002 .

Thermal stress and reliability characterization of barriers for Cu interconnects

S. Kadomura, G. Dixit, B. Zheng, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Chemical studies of CVD Cu deposited on Ta and TaN barriers under various process conditions

S. Ramaswami, N. Yoshida, S. Gandikota, 1999 .

Adhesion studies of CVD copper metallization

S. Ramaswami, S. Gandikota, Liang-Yuh Chen, 1999 .

High Planarization Efficiency and Wide Process Window Using Electro-chemical Mechanical Planarization (Ecmp TM )

F. Liu, W. Hsu, Liang-Yuh Chen, 2005 .

A low cost and residue-free abrasive-free copper CMP process with low dishing, erosion and oxide loss

Stan D. Tsai, Lizhong Sun, Lizhong Sun, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Properties of Copper Films Prepared by Chemical Vapor Deposition for Advanced Metallization of Microelectronic Devices

S. Ramaswami, M. Eizenberg, R. Kröger, 1999 .

Texture and surface morphology improvement of Al by two-stage chemical vapor deposition and its integration in an Al plug-interconnect scheme for sub 0.25 μm metallization

I. Beinglass, M. Naik, R. Mosely, 1998 .