R. Chan

Induction motors performance under symmetrical voltage sags and interruption - Test result

Surya Hardi, Syafruddin Hs, Muhd Hafizi, 2013, 2013 IEEE 7th International Power Engineering and Optimization Conference (PEOCO).

Fluid-structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

C. Y. Khor, Mohd Zulkifly Abdullah, R. Chan, 2014 .

Analysis of encapsulation process in 3D stacked chips with different microbump array

C. Y. Khor, Mohd Zulkifly Abdullah, R. Chan, 2012 .