B. Chen

Experimental study on flexural behavior of splicing concrete-filled GFRP tubular composite members connected with steel bars

B. Chen, L. G. Wang, L. Wang, 2015 .

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

K. H. Ang, X. Shi, G. Li, 2005 .

Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process

G. Li, B. Chen, 2004 .

Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint

G. Li, G. Y. Li, B. L. Chen, 2003 .