P. Nelle

Modeling of DMOS subjected to fast temperature cycle stress and improvement by a novel metallization concept

M. Stecher, E. Lilleodden, T. Smorodin, 2008, 2008 IEEE International Reliability Physics Symposium.

Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films

T. Detzel, M. Leicht, Rui Huang, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

A broadband mid-infrared laser magnetic resonance spectrometer for the spectral range of 1200–2000 wavenumbers

M. Gondal, W. Rohrbeck, W. Urban, 1983 .

Investigation and improvement of DMOS switches under fast electro-thermal cycle stress

Michael Glavanovics, Jürgen Wilde, Tobias Smorodin, 2008 .

Evaluation of Package Stress during Temperature Cycling using Metal Deformation Measurement and FEM Simulation

M. Stecher, J. März, C. Bohm, 2006 .

On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part I: Metallization

M. Stecher, P. Alpern, H. Gunther, 2009, IEEE Transactions on Device and Materials Reliability.

On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound

M. Stecher, A. Kessler, R. Tilgner, 2009, IEEE Transactions on Device and Materials Reliability.

On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part III: Chip Coating, Passivation, and Design

M. Stecher, P. Alpern, H. Gunther, 2009, IEEE Transactions on Device and Materials Reliability.

Field effect transistor with a body zone

D. Vietzke, M. Stecher, P. Nelle, 2000 .