C. Liao

Effects of cyclic temperature change on the out-of-plane deformation and diffraction angle of a surface micromachined curved grating

Ju-Nan Kuo, C. Liao, 2009 .

Fracture strength characterization and failure analysis of silicon dies

C. Y. Huang, J. D. Wu, C. C. Liao, 2003, Microelectron. Reliab..

Board level reliability of a stacked CSP subjected to cyclic bending

C. Y. Huang, S. H. Ho, J. D. Wu, 2002, Microelectron. Reliab..

An experimental study of failure and fatigue life of a stacked CSP subjected to cyclic bending

S. C. Hung, P. J. Zheng, J. D. Wu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Characterization study of lead-free Sn-Cu plated packages

Y. Chou, Yu Yao, C. Liao, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).