R. Schetty

Feasibility and reliability study on the electroless nickel bumping and stencil solder printing for low-cost flip chip electronic packaging

Y. M. Chow, W. M. Lau, R. Schetty, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Lead-free bump interconnections for flip-chip applications

R. Schetty, Z. Karim, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).