Z. Karim

Feasibility and reliability study on the electroless nickel bumping and stencil solder printing for low-cost flip chip electronic packaging

Y. M. Chow, W. M. Lau, R. Schetty, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Surface properties and solderability behaviour of nickel–phosphorus and nickel–boron deposited by electroless plating

W. M. Lau, Y. M. Chow, Z. Karim, 2001 .

Lead-free bump interconnections for flip-chip applications

R. Schetty, Z. Karim, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).