Shengwen Shu

发表

J. Ruan, Daochun Huang, Shengwen Shu, 2012, 2012 25th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV).

J. Ruan, Zhibin Qiu, Shengwen Shu, 2019, The Journal of Engineering.

J. Ruan, Daochun Huang, Shengwen Shu, 2011, 2011 1st International Conference on Electric Power Equipment - Switching Technology.

J. Ruan, Daochun Huang, Shengwen Shu, 2013, 2013 2nd International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST).

J. Ruan, Zhibin Qiu, Shengwen Shu, 2019, Power Systems.

R. Zheng, Shanming Ke, Changxin Tang, 2022, Physical Review B.

Shanming Ke, Chunchun Li, Longlong Shu, 2022, Physical Review Materials.

Xiaoyong Wei, Shanming Ke, Longlong Shu, 2022 .

Shanming Ke, Chunchun Li, Longlong Shu, 2022, Journal of Applied Physics.

Yachao Zhang, Shengwen Shu, Shiwei Xie, 2023, IEEE Transactions on Industrial Informatics.

Yuesheng Zheng, Shengwen Shu, Jun Xu, 2021, IET Generation, Transmission & Distribution.

Yongming Hu, Tingfang Tian, F. Chen, 2023, Journal of Materials Science: Materials in Electronics.

Shengwen Shu, Jun Xu, Shiyun Cao, 2023, IET Generation, Transmission & Distribution.

Yuesheng Zheng, Shengwen Shu, K. Xia, 2021, IEEE Transactions on Power Delivery.

Xiaolei Gai, Shengwen Shu, 2022, 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE).

Yuesheng Zheng, Shengwen Shu, Fuwang Liao, 2020, 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE).

Shengwen Shu, Yuesheng Zheng, Guowei Qi, 2018, 2018 IEEE International Conference on High Voltage Engineering and Application (ICHVE).

Yongming Hu, Tingfang Tian, F. Chen, 2023, Journal of Materials Science: Materials in Electronics.

Shengwen Shu, Zhicong Zheng, Bo Qu, 2023, 2023 IEEE 6th International Electrical and Energy Conference (CIEEC).

Xiaoyong Wei, Shanming Ke, Longlong Shu, 2022, 2209.04277.

Shengwen Shu, Bizhen Zhang, Zhicong Zheng, 2022, 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE).

J. Ruan, Daochun Huang, Shengwen Shu, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.