B. Métais
发表
S. Schmauder,
P. Binkele,
A. Kabakchiev,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Stefan Weihe,
Ulrich Becker,
Marta Kuczynska,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
M. Klingler,
B. Métais,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Weihe,
A. Kabakchiev,
B. Metais,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Wolter,
M. Roellig,
K. Meier,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Ingmar Kallfass,
Markus Klingler,
Marcus Sonner,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
R. Metasch,
X. Schuler,
M. Roellig,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Metasch,
M. Roellig,
M. Guyenot,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.