Chunxia Jiang

Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N0.7 Film in Cu Interconnects

P. Liaw, Yong Zhang, Rongbin Li, 2020, Advanced Engineering Materials.

Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization

Rongbin Li, Jie Xu, Chunxia Jiang, 2019, Journal of Alloys and Compounds.

Hot Deformation Behavior and Processing Maps of a 9Ni590B Steel

Rongbin Li, Tongtong Chen, Chunxia Jiang, 2020, Journal of Materials Engineering and Performance.

Microstructures, Mechanical Behavior, and Radiation Damage of (Tivcr)X-(Taw)1-X Binary System High-Entropy Alloy Films

P. Liaw, Yong Zhang, Rongbin Li, 2020, SSRN Electronic Journal.

Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System

Xin Wang, Peter K. Liaw, Yong Zhang, 2020, Entropy.

Effect of oxygen pressure on the properties of n-type cuprous oxide films prepared by pulsed laser deposition

Min Jin, Xin-lei Zhang, Chunxia Jiang, 2022, Journal of Physics: Conference Series.

Multi-component AlCrTaTiZrMo-nitride film with high diffusion resistance in copper metallization

Chunxia Jiang, Jing Zhang, B. Qiao, 2018, Journal of Alloys and Compounds.