Yu-Chen Liu
发表
S. Lin,
Yu-Chen Liu,
2019,
JOM.
S. Lin,
M. Tsai,
Yu-Chen Liu,
2021,
Materials Today Communications.
Henry H. Wu,
D. Morgan,
P. Wells,
2022,
npj Computational Materials.
Chih-han Yang,
S. Lin,
Yu-Chen Liu,
2022,
2022 International Conference on Electronics Packaging (ICEP).
Wei-hsin Chen,
S. Lin,
Yu-Chen Liu,
2022,
International Journal of Energy Research.
S. Lin,
H. Chang,
Cheng liang Cho,
2015,
Electronic Materials Letters.
Chih-han Yang,
S. Lin,
Yi-Kai Kuo,
2020,
JOM.
D. Morgan,
R. Jacobs,
S. Lin,
2019,
MRS Communications.
S. Lin,
Yu-Chen Liu,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Hsin-yi Lee,
S. Lin,
Yu-Chen Liu,
2017,
Scientific Reports.
Masahiro Yoshimura,
Wei Xie,
Shih-kang Lin,
2013,
Scientific Reports.
H. Nishikawa,
Chih-han Yang,
S. Lin,
2022,
Science and Technology of Welding and Joining.
H. Nishikawa,
Chih-han Yang,
S. Lin,
2022,
2022 International Conference on Electronics Packaging (ICEP).
Chulmin Oh,
Katsuaki Suganuma,
Shijo Nagao,
2016,
Scientific Reports.
S. Lin,
Yu-Chen Liu,
Y. Su,
2020
.
C. Chang,
S. Lin,
M. Tsai,
2022,
Materials letters (General ed.).
K. Suganuma,
Hao Zhang,
Chuantong Chen,
2020
.
H. Nishikawa,
Chih-han Yang,
S. Lin,
2023,
International Conference on Electronics Packaging.
Chih-han Yang,
Yu-Chen Liu,
Hiroshi Nishikawa,
2024,
Journal of Materials Research and Technology.
Yu-Chen Liu,
Shih-kang Lin,
K. Lin,
2022,
2022 International Conference on Electronics Packaging (ICEP).
Hsin-yi Lee,
S. Lin,
Yu-Chen Liu,
2017,
2017 International Conference on Electronics Packaging (ICEP).