A. Roy

发表

A study on electromigration by driving force approach for submicron copper interconnect

A. Roy, 2007 .

An experimental method of bioimpedance measurement and analysis for discriminating tissues of fruit or vegetable

Surajit Das, A. Roy, A. Mallick, 2020 .

Effects of mobile charged defects on current–voltage behavior in resistive switching memories based on organic–inorganic hybrid perovskite

Ho Won Jang, A. Roy, P. Cha, 2018, Applied Physics Letters.

Electric field induced charge migration and formation of conducting filament during resistive switching in electrochemical metallization (ECM) memory cells

A. Roy, P. Cha, 2020 .

Microstructure Measurement Techniques for Studying Electromigration in ULSI Interconnects

A. Roy, A. Adhikari, 2016 .

Experimenting and modeling of catastrophic failure in electromigration-induced resistance degradation for deep submicron dual-damascene copper interconnects

A. Roy, A. Adhikari, 2018, Solid-State Electronics.

Design of efficient loadcell for measurement of mechanical impact by piezoelectric PVDF film sensor

A. Roy, P. Guin, 2016 .

A Realization Scheme for Half-adder at Room Temperature by Two Transition Pulses in NMR Quantum Information Processing

A. Roy, Dibyendu Chatterjee, 2015 .

Application of gamma distribution in electromigration for submicron interconnects

Cher Ming Tan, Nagarajan Raghavan, Arijit Roy, 2007 .

Current crowding effect on copper dual damascene via bottom failure for ULSI applications

A. Krishnamoorthy, A. V. Vairagar, S. Mhaisalkar, 2005, IEEE Transactions on Device and Materials Reliability.

Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects

Cher Ming Tan, Arijit Roy, C. Tan, 2006 .

Dynamics of electromigration induced void in submicron Cu interconnects

Arijit Roy, A. Roy, 2011, 2011 International Conference on Communication and Industrial Application.

Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure

Cher Ming Tan, Arijit Roy, C. Tan, 2007 .

Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures

Rakesh Kumar, Cher Ming Tan, Arijit Roy, 2005, Microelectron. Reliab..

Measurement of bioimpedance and application of Cole model to study the effect of moisturizing cream on human skin

A. Roy, Soumyajit Podder, Somnath Bhattacharjee, 2020 .

Synthesis of Quantum Multiplexer Circuits

A. Roy, Dibyendu Chatterjee, Subhasis Pal, 2012 .

Identification of Bioimpedance Parameters for Characterizing of Tissue: A Case Study with Apple Tissue by ANOVA

Arijit Roy, Pranay Biswas, Abhishek Mallick, 2019, 2019 International Conference on Ubiquitous and Emerging Concepts on Sensors and Transducers (UEMCOS).

Multiple data access via a common cavity bus in circuit QED

Arijit Roy, Dibyendu Chatterjee, A. Roy, 2017, Int. J. Circuit Theory Appl..

A transmon-based quantum half-adder scheme

Arijit Roy, Dibyendu Chatterjee, A. Roy, 2015 .

Fabrication and characterization of copper interconnects of line-width down to 100nm using a specially designed phase shift mask

A. Roy, 2014 .

Inadequacy of Markov Model in Modeling of Electromigration-Induced Resistance Degradation

A. Roy, A. Adhikari, 2018, 2018 IEEE Electron Devices Kolkata Conference (EDKCON).

Room temperature observation of point defect on gold surface using thermovoltage mapping

Cher Ming Tan, Arijit Roy, Sean J. O'Shea, 2007, Microelectron. Reliab..